Facilities Growth and Fabrication: Characterization:
Growth and Fabrication: |
||
1. Magnetron Sputtering System |
||
Specification: 1. Chamber : Main (< 5 x10^-9 Torr, up to 800 ºC, 6 gun ports), Loadlock (< 1 x10^-8 Torr) 2. Automatic pressure control unit 3. DC Power supply : Max 1000 W, CW CV CC control Manual: |
||
2. Dry transfer system for 2D materials |
||
Specification: 1. Optical microscope (Nikon) : DS-Ri2 (Camera), Objective lens (5x, 10x, 20x, 50x, 100x), LED Lamphouse 2. XYZ stage : 8-axis manual & motorized linear stage, motorized linear stage (resolution : 0.05 µm, range : 25 mm, 3-axis), heat up to 200 ºC 3. Vibration isolation stage (IVIC) 4. Conditions : O2, H2O < 1 ppm in Ar-filled glove box Manual: |
||
3. Atomic layer deposition |
||
Atomic layer deposition: Tutorial, Animation Specification: 1. Chamber: colsed coupled sample heater up to 500 C, QCM monitor 2. Gas delivery line: 2 carrier gas lines, 3. Precusor cells(2 with temperature control), plasma source line 4. Software control: Robo ALD process control Manual: |
||
4. Metal processing chamber |
||
Specification: 2 thermal sources, 1 e-beam source (6kW, 7cc multi pocket), LN2 trap for substrate holder Manual: |
||
5. Organic processing chamber |
||
Specification: 3 temperature controllable organic source, 1 thermal sources, LN2 trap for substrate holder Manual: |
||
6. Glove box system |
||
Specification: 1. Organic process chamber unit Features: 3 temperature controllable organic source, 1 metal sources, LN2 trap for substrate holder 2. Metal process chamber unit Features: 2 metal sources, 1 e-beam source (6kW, 7cc multi pocket) 3. 2 Glove box units with T-antichamber connection Manual: |
||
7. Photo-lithography yellow room |
||
Specification: Manual: |
||
8. Mask aligner (UCRF) |
||
Specification: 1. Up to 6inch 2. UV lamp : Hg 350W 3. Wavelength : 350 ~ 450nm(I, H, G-line) 4. Lamp uniformity : ≤ 3% 3. Dual microscope(90X ~ 500X) Manual: |
||
9. Dielectric RIE (UCRF) |
||
Specification: 1. Etch Rate: 1000 - 3000 Å/min 2. Selectivity: ≤ 2±0.5:1 SiN:PR 3. Uniformity: ≤ ±3.0 % 4. RF Power: 600W 5. Selectivity:SiO2:Resist = 3~5 : 1 (Resist dependent) Manual: |
||
10. E-beam lothography (UCRF) |
||
Specification: 1.Theoretical beam size : 2.1 nm for 100 keV, 7 nA 2. Line width : ≤ 5 nm 3. Deflection : vector scan, 55 MHz 4. Address grid resolution : 1 nm, 1 mm main field 5. Beam voltage : 30 ~ 100 keV 6. Writing area : 195 mm x 195 mm 7. Substrate size : 5 ~ 200 mm 8. Automation : 10 chucks automatic loading 9. Repeatable : 20 nm over wafer Manual: |
||
Characterization: |
||
1. Physical properties measurement system (PPMS) |
||
Specification: 1. Temperature Range : 1.9 K - 400 K - Cryogen-free cooling technology. - Continuous low-temperature control - Controlled temperature sweep mode) - Temperature accuracy : ±0.5 % - Temperature stability : 0.2 % for T ≤10 K, 0.02 % for T > 10K 2. Magnet & Uniformity - Magnet range : ±9 T (90,000 Gauss) - Field resolution : 0.3 Oe to 1 T: 3 Oe to 9 T - Slew Rate : Up to 200 Oe/sec 3. Elecrical Transport Option (ETO) - Current Source Specifications: Current Range (10 nA to 100 mA), Frequency Range (DC, and 0.1Hz to 200 Hz AC) - Resistance Specifications: Absolute Accuracy (0.1% for R < 200 kOhms), Relative Sensitivity (±10 nOhms RMS) - Resistivity Range: 4uOhms to ~10 MOhms in 4-wire mode, 1 MOhms to ~5 GOhms in 2-wire mode (typical) 4. Vibrating Sample Magnetometer - Geometry: Magnetic field II vibration and first order gradiometer coils, Coil-set bore (6.3 mm) - Sample holders provided: Tube (inner diameter = 3.2 mm; outer diameter = 4.8 mm) Paddle (diameter = 3.2 mm), coil-set baseline (9 mm) - VSM measurement parameters: VSM oscillation frequency (calibrate): 40 Hz VSM oscillation amplitude(typical): range of 0.5 mm - 10 mm peak-peak (typically 4 mm peak-peak) - Sensitivity using the above typical parameters Sensitivity : 2X10-6 emu/tesla with 1sec. averaging (typical) Largest measurable moment : ∼150 emu (40 Hz, 1 mm p-p) - VSM oven upto 1000 K 5. Thermal Transport System - Thermal Conductivity κ - Seebeck coefficient S - Thermoelectric figure of merit ZT 6. Heat Capacity - Temperature Range : 1.9 K - 400 K - Sample Size: 1 - 500 mg(20 mg, typ.) - Heat Capacity Resolution: 10 nJ/K at 2 K - Measurement Accuracy: < 5%, 2 - 300 K < 2%, typ. 7. External electronics - Keithley 2636 Duel channel sourcemeter - Keithley 2400 Sourcemeter - Keithley 2182A Nanovoltmeter - Keithley 6221 AC/DC current source - EG&G 5209 Lock-in amplifier - SR310 High voltage Manual: |
||
2. Magnetic properties measurement system (MPMS) |
||
Specification: 1. Temperature Range : 1.9 K - 400 K - Cryogen-free cooling technology. - Continuous low-temperature control - Controlled temperature sweep mode) - Temperature accuracy : ±0.5 % - Temperature stability : 0.2 % for T ≤10 K, 0.02 % for T > 10K 2. Magnet & Uniformity - Magnet range : ±9 T (90,000 Gauss) - Field resolution : 0.3 Oe to 1 T: 3 Oe to 9 T - Slew Rate : Up to 200 Oe/sec Manual: |
3. Closed cycle cryostat (to be updated) |
|
Specification: Manual: |
||
4. Probe station |
||
Specification: Manual: |
||
5. Optical Microscope |
||
Specification: Manual: |